Simulation and Analysis of an Integrated Device to Simultaneously Characterize Thermal and Thermoelectric Properties

For many applications, multiple material properties impact device performance and characterization of multiple properties using a single sample is desirable. In this article, the authors focus on thermoelectric materials characterization, which requires the thermal conductivity, electrical conductivity, and Seebeck coefficient to be quantified. Specifically, the authors present a design analysis using numerical COMSOL simulations of the 3ω technique to optimize a measurement structure for thermoelectric films while also including the capability for electrical measurements to be performed on the same sample without detachment or repositioning. Thermal optimization of the structure is achieved through investigation of temperature spatial uniformity, the impact of heater line width on the fitted thermal conductivity, and the impact of uncertainty in material properties and geometric parameters on the fitted thermal conductivities for the material of interest.